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Board-to-Board

10BBC050-H30-BS01000 Precision where boards meet.

Review 10BBC050-H30-BS01000 using the available catalog data, product view and reference drawings. Confirm the exact variant before design-in.

10BBC050-H30-BS01000 product rendering
PRODUCT VIEW10BBC050-H30-BS01000
0.5 mmPitch
10 pinContacts
3.0 mmMated height
Dual rowRows
−40 ~ +125 ℃Operating temperature
50 cyclesMating cycles
02 / UP CLOSE

See the structure.

Review supplied product and engineering views. Confirm the exact variant against the current controlled drawing.

10BBC050-H30-BS01000 product rendering
Product rendering0.5 mmPitch10 pinContacts3.0 mmMated height
DETAIL / 01

Check the
geometry.

Use this drawing as a reference for shape and orientation. Request the controlled drawing for the exact part before approving a PCB layout.

10BBC050-H30-BS01000 engineering reference drawingENGINEERING VIEW
03 / MATING SYSTEM

Two sides.
One system.

Review the mating counterpart, target stack height and assembly direction together.

10BBC050-H30-BS01000 product rendering
Mating & assembly

Confirm the mating part.

The catalog lists 10BBC050-H30-BPXXXXX. Confirm the exact variant, geometry and stack height with engineering.

10BBC050-H30-BPXXXXX
Images show reference geometry; use the current controlled drawing for PCB design.
PRODUCT OVERVIEW

About this model.

10BBC050-H30-BS01000 is a board-to-board connector listed in the factory product catalog. Its recorded selection points include 0.5 mm pitch, 10 contacts contacts, 3.0 mated height. The part number should be checked against the board or cable interface before any footprint is released.

The catalog lists SMT as the termination method. It names 10BBC050-H30-BPXXXXX as a mating part or series; engineering should confirm the precise counterpart and assembly height. Consider contact assignment, insertion direction, tooling access and the total tolerance stack in the completed product.

Use the specifications and drawings below as a traceable starting point for 10BBC050-H30-BS01000. Values shown for a series are not a substitute for a released variant drawing. Request the latest datasheet, confirm any pending fields with engineering and validate the complete assembly under your own project conditions before production design-in.

04 / TECHNICAL SPECIFICATIONS

Engineering, at a glance.

Catalog values below are tied to the product series or variant shown. Request the current controlled datasheet.

01 Mechanical

Pitch
0.5 mm
Mated height
3.0 mm
Termination
SMT
Insertion force
0.981N(100gf) Per Pin MAX
Mating direction
Vertical mating
Withdrawal force
0.07848N(8gf) Per Pin MIN
Rows
Dual row
Contact material
Phosphor bronze copper alloy
Contact plating
Gold 4 μin minimum at contact and solder areas
Contacts
10 pin

02 Electrical

Insulation resistance
500 MΩ minimum
Rated voltage
50 V AC per pin
Rated current
0.5 A AC/DC per pin
Withstanding voltage
500 V AC
Contact resistance
50 mΩ maximum initially; 100 mΩ maximum after testing

03 Environmental

Mating cycles
50 cycles
Operating temperature
−40 ~ +125 ℃
Housing flammability
UL94V-0

04 Mating & assembly

Mating part
10BBC050-H30-BPXXXXX

Specifications source: factory catalog (PPT, slide 29) / datasheet CSP-10BBC-00-00 rev C / factory supplementary record; revision pending confirmation. Confirm current controlled documents before design release.

05 / VARIANT DIMENSIONS

Choose the pin count. Check the geometry.

Dimensions are in mm, following the drawing columns. In formula rows, n is the number of contacts per row.

PIN countDIM A (mm)DIM B (mm)DIM C (mm)
10 contacts → · this model5.602.004.20
20 contacts →8.104.506.70
30 contacts →10.607.009.20
40 contacts →13.109.5011.70
50 contacts →15.6012.0014.20
60 contacts →18.1014.5016.70
70 contacts →20.6017.0019.20
80 contacts →23.1019.5021.70
07 / ENGINEERING VIEWS

Geometry made legible.

Select a view to open it at full size.

Dimension drawing

10BBC050-H30-BS01000 dimension drawing from factory technical source

Technical view 2

10BBC050-H30-BS01000 technical drawing or pcb layout from factory technical source

Technical view 3

10BBC050-H30-BS01000 technical drawing or pcb layout from factory technical source

Reference drawing

10BBC050-H30-BS01000 reference drawing from factory technical source

Reference drawing – request the controlled datasheet for design-in

08 / PAIRING & SERIES

A connector is a system.

Check both halves and the intended stack height before approving a footprint.

10BBC050-H30-BS01000 product rendering
Mating series

10BBC050-H30-BPXXXXX

Confirm the exact order code with engineering.

Ask about the pair
10 / FROM THE FACTORY

Precision has a process.

Kunshan, Jiangsu

Founded in 2021, Weicheng designs and develops molds, automation equipment and production lines in-house. Approximately 90% of production processes are fully automated.

Explore manufacturing →
Precision stamping die at a precision stamping workstation01 / PROCESSSTAMPING
Injection molding workshop in an injection molding area02 / PROCESSMOLDING
Wide view of an automated electronics assembly line03 / PROCESSASSEMBLY
Automated optical inspection at a connector inspection station04 / PROCESSINSPECTION
Contact profile measurement at a connector inspection station05 / PROCESSQUALITY
11 / ENGINEERING RESOURCES

The files behind the design.

Request current controlled files for this exact model.

PDF

Datasheet

Current model specifications

2D

2D drawing

Controlled dimensions and PCB layout

3D

3D model

Mechanical integration file, if available

12 / FAQ

Good questions. Clear answers.

Where can I review dimensions for 10BBC050-H30-BS01000?

The reference drawing and PIN × DIM table appear on this page. Request the controlled datasheet for design-in.

How do I check the mating part for 10BBC050-H30-BS01000?

Review the listed mating series and confirm the exact variant and stack height with engineering.

Can I request files or samples for 10BBC050-H30-BS01000?

Add the part number to the technical inquiry with your target contact count, quantity and project stage.

Technical review

Tell us what you are building.

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